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Nano-Join

Lupe

Production & distribution of nano sinter pastes


Team:
Tobias Röhrich (Dipl.-Ing.),
Gunnar Schulze (M.A.),
Dr. rer. nat. Battist Rábay

Sector:
Microelectronics

Mentor:
Prof. Dr. Ing. Rainer Starke,
Dr. rer. nat. Annerose Oestreicher

Faculty:

V – Mechanical Engineering and Transport Systems

Support:
EXIST Startup grant (2015)

Next Generation Sintering Technologies

Lupe

Our idea

Nano-Join develops, produces and sells unprecedented nano sinter pastes for integrated circuit packaging. The silver sinter pastes manufactured by Nano-Join have been designed for applications in power electronics and allow for connections with highest thermal/electrical conductivity at simultaneously low process temperatures. Due to nano effects, dense and massive silver layers can be created pressureless below 250°C on various surfaces, e.g. directly on copper. Especially for components with high thermal exposure, the Nano-Join process enables a significant improvement of thermal management and thus creates more reliable and durable connections.

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